NOVEMBER 12 -15, 2024
SEMICON Europa is the largest European electronics platform connecting industry leaders across the entire design and manufacturing supply chain.
Room Temperature Wafer Bonder
Product: Wafer (Si,GaAs,Quartz Glass,Au, etc)
- No Heating in bonding process
- Applicable to various materials
- High productivity due to no heating/cooling cycle
Micro Solder Ball Mounter
Product: WLP, WLCSP, FOWLP, FOPLP, etc.
- Ball Dia 50μ~ / Ball Pitch 90μ
- Top Share (80% Wafer/60% Substrate)
- 1 Line Solution (Mounting, Repair, Inspection)
Auto Packing/Unpacking System
Product: FOUP, Reel, Tray, HWA, etc.
- APK 12inch 35pcs/8inch 50pcs(1H)
- Great Price / Great Quality
- Delivery Record : ~100units+
Contact us for a free ticket
Mr. Kevin Davy
kevin.davy@djkeurope.com
Phone +49 151 1678 2911